SMT solder paste
SPEEKO solder paste is made up of solder powder with low oxygen content,high roundness after advanced ultrasonic atomizing processes and soldering flux,independently rsearched and improved process based on the advanced Japanese soldering technology. The entire production is completed under the vacuum or nitrogen gas environment. It has comparatively high collapse resistance and good printabilityetc, so it is adaptable to print at fine pitch and can maintain long-term adhesiveness .
A Guide to the Selection of Solder Paste
|特 性 Property||备 注 Remarks|
The printing life is special service, the residues is colorless and transparent, the dielectric resistance is extremely high. It is suitable for the aviation product.
It is applicable to the printing and reflow of general surface No side balling and heat collapse, etc. occurrence.
It contains halides used for rinsing processes.
Exceptionally soldering effect, capable of quickly removing oxide.
Used for heat radiators and more difficult soldering processes
* For the content of alloy, please refer to the table for commonly used solder alloy.
* Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.