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SMT solder bars

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SPEEKO solder bars are generated under the conditions of using high purity metals and rigorous quality controlled by adding anti-oxidant elements in manufacturing processes to remove the oxidants in solders, and the production rate of the solder splash

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Products Details

锡条
Solder Bar
锡条是在使用高纯度金属及严格品管条件下生产而成,在制程中添加抗氧化成份排除焊锡中氧化物之形成, 锡渣的产生率降到最低,永安锡条都符合甚至超越J-STD-006&JIS-Z-3282AR的标准要求。

SPEEKO solder bars are generated under the conditions of using high purity metals and rigorous quality

controlled by adding anti-oxidant elements in manufacturing processes to remove the oxidants in solders,

and the production rate of the solder splash is reduced to the minimum. Yong An solder bars meet and even

surpass the requirements of J-STD-006 &JIS-Z-3282AR standards.

常用锡条性能对照表
Contrast of Commonly Used Solder Bars
品 名
Particulars
熔 点℃
Melting point ℃
密 度g/cm3
Density g/cm3
使用温度℃
Usage
Temperature
最终润湿力(mN)
Ultimate Wetting Force
拉伸试片 (N/mm2)
Tensile Strength
剪切试片 (N/mm2)
Shear Strength
QFP引线45°角拉断力(N)
Laed Wire Abruption Force
贴片元件剪切力 (N)
Shear Force
Sn-37Pb 183 8.41 250±10 60 116 35 22 29
Sn-0.7Cu 227 7.3 265±5 55 95 38 21 28
Sn-0.3Ag0.7Cu 217~227 7.3 265±5 55 91 36 20 27
Sn-3.0Ag0.5Cu 217 7.13 260±5 55 107 36 23 29


* 我公司还备有其它成份焊锡供客户选择,请参照常用焊锡合金表。
* Our company also has solders of other contents for the option by clients. Please refer to the Table of Commonly Used Solder Alloy.