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Lead free BGA ball

darthub

Alloy:Sn-Cu-Ti,Sn-Ag-Cu-Bi,Sn-Ag-Cu,Sn-Ag.Diameter range:0.2-0.9mm.High quality...

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Products Details

SPEEKO reserves the intellectual property rights of “Production Means and Equipment for BGA Solder Balls” . This patented technology can be used to produce alloy solder balls of various types, featuring its simple operation and the high quality.

Specification & category

Alloy

Sn-Cu-Ti;Sn-Ag-Cu-Bi;Sn-Ag-Cu;Sn-Ag

Specification

Diameter range:0.2-0.9mm

Reference standard: JIS-Z-3282S